10-layer HDI board
Parameters
Thickness: 1.6 ±0.16mm
Min. Distance Between Line and Width: 0.069mm/0.075mm
Min. Via/PAD: 0.15mm/0.4mm
Min. Buried Via/PAD: 0.2mm/0.5mm
Min. Blind Via/PAD: 0.125mm/0.43mm
Min. Distance from Via to Line: 0.17mm
Thickness: Surface Copper≥30um; Min. Hole Copper: 18um; Average: 20um
Surface Treatment: Immersion Ni & Pd & Au
Impedance: 100±10%